Samsung Electronics is reportedly revisiting plans to take a position $7 billion within the US

Samsung Electronics is reportedly revisiting plans to take a position $7 billion in a sophisticated packaging (AP) plant for high-bandwidth reminiscence (HBM) in the US, in keeping with the Korean Financial Day by day. The proposed facility could be positioned adjoining to Samsung’s present chip fab in Taylor, Texas, and would strengthen its place within the fast-growing AI chip provide chain.

In the meantime, SK Hynix is claimed to be contemplating the development of a brand new DRAM manufacturing line within the U.S., doubtlessly increasing its footprint past the superior packaging facility deliberate for Indiana underneath the CHIPS Act.

The strikes replicate intensifying efforts by main South Korean chipmakers to bolster U.S.-based operations amid rising demand for AI semiconductors and strategic incentives from Washington to localize semiconductor provide chains.

This text was written by Aaron Cutchburt at investinglive.com.